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Optoelectonics Packaging Engineer

Дата публикации: 26/02/2016
Зарплата: 100 000 - 130 000 USD
Расположение работы: USA
Индустрия: Aerospace/ Defence
Контактный телефонный номер: +31 20 4919874


  • Develops and manufactures opto-electronic
  • components and sub-systems for diverse markets like defense, medical,
  • industrial sensing and telecommunications. They focus on high
  • performance, high reliability products that integrate complex functionality in
  • order to meet challenging and technology leading customer requirements. Products
  • include photodetectors for cameras, 3D imaging, focal plane arrays, etc.; as
  • well as a variety of laser diode products.


  • An opto-mechanical packaging engineer is needed to help
  • unleash the market leading performance of their lasers and detectors. The
  • ideal candidate is one who is passionate about optical packaging and product
  • delivery in a fast paced and dynamic environment. Experience in integration of
  • optical chips, fiber, bulk optics, electronics and cooling to deliver high
  • performance products is critical. Desirable functional skill sets
  • include:
  • Opto-mechanics, including integration of lasers and optics
  • Packaging of focal plane arrays for imaging
  • Able to work on a project basis - take chips delivered from a fab, perform all design and
  • development, and then release to in-house production
  • Mechanical design and thermal analysis and modeling
  • Develop complex packaging processes
  • SolidWorks experience
  • Understanding of reliability
  • Materials engineering and process expertise in chip bonding, wire bonding, die bonding and laser welding
  • Preferred educational background includes a M.S. in Optics, Mechanical or Materials Engineering. A minimum experience of 5 years and U.S. citizenship or permanent residency status is required

Условия работы:

  • There is a search for a Optoelectonics Packaging Engineer